First samples on the first run from wafer.space!
There is a disclaimer with these parts, that only ~80% are fully bonded successfully.
This could be marketed as a feature, an air gapped solution using state of the art wireless bond wires. 😜
@RoganDawes@infosec.exchange They can be yes! And some designs actually want that! i.e. CMOS camera sensors.
I'm not sure if they'll always be clear like this, but it's makes them better to show off. Easy enough to paint them if needed.
@mole99@fosstodon.org I don't have a bringup PCB designed. Very un-organised on my end. I'm thinking I'll bodge-wire a SPI FLASH to see if I can get to Blinky this weekend. ✨